The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Aug. 15, 2024
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Edy Cardona, Fremont, CA (US);

Eric Kihara Shono, San Mateo, CA (US);

Martin John Ripley, San Jose, CA (US);

Hansel Lo, San Jose, CA (US);

Christopher S. Olsen, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01); H01J 37/32 (2006.01); H05H 1/34 (2006.01); H05H 1/40 (2006.01); H05H 1/54 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01);
Abstract

The present disclosure generally relates to a processing system comprising a flow assembly for processing thin substrates using low flow rates. The flow assembly comprises at least one compression part configured to compress a volume occupied by gas radicals flowing at a rate of about 0.1 sim to 5 slm from a plasma source to a chamber in two dimensions. The at least one compression part compresses the volume occupied by the gas radicals about 50% to about 90% from an initial cross-sectional area of the port of the process chamber. In some embodiments, the at least one compression part is a two compression parts, where a first compression part coupled to the port of the process chamber is larger in volume than a second compression part coupled to the first compression part and the chamber. In such an embodiment, the first and second compression parts are removable.


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