The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Feb. 12, 2025
Applicant:

Parker-hannifin Corporation, Cleveland, OH (US);

Inventors:

Steve A. Krane, Cochise, AZ (US);

Dean R. Pollee, Mattawan, MI (US);

Evan W. Anderson, Portage, MI (US);

Daniel P. Rapin, Schoolcraft, MI (US);

Assignee:

Parker-Hannifin Corporation, Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F04B 1/29 (2020.01); F04B 1/26 (2006.01); F04B 49/10 (2006.01); F16K 31/00 (2006.01);
U.S. Cl.
CPC ...
F04B 1/29 (2013.01); F04B 1/26 (2013.01); F04B 49/10 (2013.01); F16K 31/002 (2013.01);
Abstract

A pump system including a prevention mechanism for preventing excessive fluid temperature buildup of system fluid. The overheat prevention mechanism includes a thermally-responsive control component made with a thermally-responsive material. The thermally-responsive control component is located in the pump system such that the thermally-responsive material is in thermal communication with the system fluid for effecting a change in temperature of the thermally-responsive material. The thermally-responsive material is configured to have an activation temperature that is a predefined amount less than a maximum operating temperature of the system fluid. The thermally-responsive control component is configured to cooperate with a pump control mechanism in the system to decrease pump output pressure in response to the thermally-responsive material being heated by the fluid to a temperature that is equal to or greater than the activation temperature of the thermally-responsive material.


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