The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Sep. 23, 2022
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Shingo Tsuno, Kanagawa, JP;

Takayuki Kanno, Kanagawa, JP;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09J 163/00 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01);
Abstract

The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a photocationic polymerization initiator, and (c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl)borate compound, wherein the amount of the component (a1) is 20 to 95 parts by mass, the amount of the component (a2) is 3 to 55 parts by mass, and the amount of the component (a3) is 3 to 45 parts by mass, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).


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