The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Oct. 31, 2023
Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi, JP;

Inventors:

Keisuke Kato, Toyota, JP;

Toshiyuki Ario, Ogaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 101/06 (2006.01); B32B 5/20 (2006.01); B32B 27/06 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 37/15 (2006.01); C08J 9/34 (2006.01); C08J 11/06 (2006.01); C08L 23/00 (2006.01); C08L 77/00 (2006.01);
U.S. Cl.
CPC ...
C08L 101/06 (2013.01); B32B 5/20 (2013.01); B32B 27/065 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 37/15 (2013.01); C08J 9/34 (2013.01); C08J 11/06 (2013.01); C08L 23/00 (2013.01); C08L 77/00 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2266/025 (2013.01); B32B 2270/00 (2013.01); B32B 2307/558 (2013.01); B32B 2323/00 (2013.01); B32B 2377/00 (2013.01); C08J 2300/106 (2013.01); C08J 2323/00 (2013.01); C08J 2400/106 (2013.01); C08J 2423/00 (2013.01);
Abstract

A molded body includes a non-foamed design layer, a foamed intermediate layer, and a non-foamed back layer, laminated in this order and formed of a first, second, and third resin compositions, respectively. The first, second, and third resin compositions contain a polyolefin as a main component. The first resin composition is an impact-resistant resin composition including a polyolefin, a polyamide, and a polyolefin-based modified elastomer having a reactive group reactive with the polyamide. A method of producing the molded body includes disposing a first support layer to serve as the design layer and a third support layer to serve as the back layer so as to be spaced apart from and face each other, interposing the second resin composition provided with foamability in a gap between the first and third support layers, and forming the intermediate layer by expanding the gap while causing the second resin composition to foam.


Find Patent Forward Citations

Kato, Keisuke. (2026). Molded body, method of producing the same, and recycling method (U.S. Patent No. 12600863). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12600863

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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