The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Oct. 03, 2019
Applicant:

Kuraray Co., Ltd., Okayama, JP;

Inventor:

Makoto Suzuki, Kurashiki, JP;

Assignee:

KURARAY CO., LTD., Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/30 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B32B 7/12 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2307/308 (2013.01); B32B 2307/536 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2553/00 (2013.01);
Abstract

There is provided a multilayer structure having a hard layer (A) and either a resin composition layer (B1) or a resin composition layer (B2), wherein the hard layer (A) has a puncture strength of 40 N/mm or more and 150 N/mm or less; the resin composition layer (B1) is made of a resin comprising an ethylene-vinyl alcohol copolymer (b1) having a melting point Tm1 of 170° C. or more and an ethylene-vinyl alcohol copolymer (b2) having a melting point Tm2 of less than 170° C.; and the resin composition layer (B2) is made of a resin comprising a modified ethylene-vinyl alcohol copolymer containing a modifying group having a primary hydroxy group represented by formula (I). The multilayer structure is excellent in mechanical strength and thermal formability, and when being recovered, allows for melt kneading with less hard spots due to resin deterioration (gelation), showing excellent recyclability.


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Suzuki, Makoto. (2026). Multilayer structure and packaging material comprising same (U.S. Patent No. 12600542). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12600542

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