The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Jan. 21, 2022
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Bo Song, Corvallis, OR (US);
Jacob Sterle, Corvallis, OR (US);
Tsuyoshi Yamashita, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1637 (2013.01); B41J 2/14072 (2013.01); B41J 2/1601 (2013.01); B41J 2/1623 (2013.01); B41J 2/1631 (2013.01); B41J 2/1635 (2013.01);
Abstract
In example implementations, a fluidic die is provided. The fluidic die includes a silicon sliver with a plurality of nozzles to eject a printing fluid. A conductive path is deposited along a length of the silicon sliver on opposite sides of the silicon sliver. The conductive path and a portion of the silicon sliver are encapsulated by an epoxy molding compound.
Song, Bo. (2026). Polymer based conductive paths for fluidic dies (U.S. Patent No. 12600135). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12600135
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile