The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Jul. 05, 2023
Canon Kabushiki Kaisha, Tokyo, JP;
Koji Kitani, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A technique capable of ensuring a sealing property between channels even with downsizing is to be provided. A method for manufacturing a liquid ejection chip equipped with an ejection unit which is configured to be capable of ejecting a plurality of liquids, and a plurality of channels which are configured to separately store the plurality of liquids to be supplied to the ejection unit, includes: filling a molten resin into a mold into which a substrate in which the ejection unit is installed on one surface and a groove and a protrusion for forming the channels are formed on the other surface is loaded, and curing the molten resin, thereby forming a resin member on the protrusion with the molten resin, the resin member forming a partition separating a space within the channels adjacent to each other.