The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

May. 25, 2022
Applicant:

Ab Sandvik Coromant, Sandviken, SE;

Inventors:

Linus Von Fieandt, Sandviken, SE;

Raluca Morjan Brenning, Sandviken, SE;

Jan Engqvist, Sandviken, SE;

Assignee:

AB Sandvik Coromant, Sandviken, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); C23C 16/34 (2006.01); C23C 16/36 (2006.01); C23C 16/40 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
B23B 27/148 (2013.01); C23C 16/0272 (2013.01); C23C 16/308 (2013.01); C23C 16/34 (2013.01); C23C 16/36 (2013.01); C23C 16/403 (2013.01); C23C 16/56 (2013.01); B23B 2228/105 (2013.01);
Abstract

A cutting tool includes a substrate at least partially coated with a coating. The substrate is a cemented carbide, cermet or ceramic. The coating includes a layer of Ti(C,N), a layer of AlOand there between a bonding layer. The Ti(C,N) layer is composed of columnar grains, wherein an average grain size Dof the Ti(C,N) layer is 25-50 nm, and wherein the Ti(C,N) layer includes a portion B1 that is adjacent to the bonding layer. An average grain size of the Ti(C,N) grains in portion B1 is larger than the average grain size Din the whole Ti(C,N) layer. In the portion B1 of Ti(C,N) layer the Ti(C,N) grains has an average grain size of 140-300 nm.


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