The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Apr. 25, 2023
Mitsubishi Electric Corporation, Tokyo, JP;
Yosuke Nakata, Tokyo, JP;
Norikazu Sakai, Tokyo, JP;
Yuji Sato, Tokyo, JP;
Yoshinori Yokoyama, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.