The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Nov. 18, 2022
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Jia-Sin Lin, Miaoli County, TW;

Wen-Chi Fang, Miaoli County, TW;

Jen-Hai Chi, Miaoli County, TW;

Zhi-Fu Huang, Miaoli County, TW;

Pei-Chi Chen, Miaoli County, TW;

Wan-Chun Tsai, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 25/00 (2006.01); H10D 1/64 (2025.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 25/50 (2013.01); H10D 1/64 (2025.01); H10D 30/6732 (2025.01); H10D 30/6745 (2025.01); H10D 30/6746 (2025.01); H10D 30/6755 (2025.01);
Abstract

This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.


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