The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Apr. 21, 2023
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Inventors:

Jun Hee Park, Hwaseong-Si, KR;

Sung Taek Hwang, Seoul, KR;

Nam Sik Kong, Hwaseong-Si, KR;

Myung Ill You, Gwangju, KR;

Assignees:

Hyundai Motor Company, Seoul, KR;

Kia Corporation, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); H10W 40/25 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/098 (2026.01); H10W 90/401 (2026.01); H10W 40/255 (2026.01); H10W 72/07354 (2026.01); H10W 72/347 (2026.01); H10W 72/856 (2026.01); H10W 72/877 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract

A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.


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