The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
May. 23, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventor:
Effendi Leobandung, Stormville, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); G03F 9/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10W 46/00 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01);
U.S. Cl.
CPC ...
H10W 46/00 (2026.01); G03F 9/7042 (2013.01); G03F 9/7046 (2013.01); H10W 90/00 (2026.01); H10W 46/301 (2026.01); H10W 72/07221 (2026.01); H10W 72/07231 (2026.01); H10W 72/234 (2026.01); H10W 72/242 (2026.01);
Abstract
Aspects of the present invention provide a semiconductor structure. The semiconductor structure may include a substrate having a first substrate alignment structure. The semiconductor structure may also include a first die with a first die alignment structure. The first die may be attached to the substrate with the first substrate alignment structure matched to the first die alignment structure.