The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Jun. 27, 2023
Shanghai Huali Microelectronics Corporation, Shanghai, CN;
Shanghai Huali Microelectronics Corporation, Shanghai, CN;
Abstract
The present application discloses a method for analyzing a layout pattern density, comprising: step, providing layouts of a chip, and merging the layouts to form a wafer level layout, wherein the wafer level layout presents a first circle in a top view, and the layout comprises a plurality of mask layers; step, segmenting the first circle to form a plurality of check windows; step, searching for the mask layer containing the patterns having a height morphology, and combining the found mask layers into a pattern layer combination; step, sequentially calculating a pattern density of the pattern layer combination in each check window; and step, recording the pattern density in each check window on a third circle to form a wafer level pattern density distribution diagram. The present application can predict a height morphology of a top surface of a wafer related to a layout.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile