The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Apr. 20, 2021
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Hajime Mitsuishi, Yokohama, JP;

Isao Sugaya, Kawasaki, JP;

Masaki Tsunoda, Kamakura, JP;

Kazuhiro Suzuki, Tokyo, JP;

Takashi Shiomi, Yokohama, JP;

Minoru Fukuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6833 (2013.01); H01L 21/6838 (2013.01); B32B 43/006 (2013.01); H01L 21/67028 (2013.01); H01L 21/67253 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1983 (2015.01);
Abstract

Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.


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