The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Aug. 31, 2022
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Takaaki Nagata, Isehara, JP;

Tatsuya Sakuishi, Atsugi, JP;

Kohei Yokoyama, Fujisawa, JP;

Yasuhiro Jinbo, Isehara, JP;

Taisuke Kamada, Niiza, JP;

Akihiro Chida, Isehara, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H05K 1/189 (2026.01); H10K 59/38 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01); H10K 71/16 (2023.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H05K 1/189 (2013.01); H10K 59/873 (2023.02); H10K 71/00 (2023.02); H10K 71/166 (2023.02); H10K 77/111 (2023.02); H05K 2201/10128 (2013.01); H10K 59/38 (2023.02);
Abstract

A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.


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