The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Jun. 30, 2022
Applicant:

Playnitride Display Co., Ltd., MiaoLi County, TW;

Inventors:

Yen-Yeh Chen, MiaoLi County, TW;

Yu-Jui Tseng, MiaoLi County, TW;

Chih-Ling Wu, MiaoLi County, TW;

Assignee:

PlayNitride Display Co., Ltd., MiaoLi County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/075 (2006.01); H10D 86/40 (2025.01); H10H 20/819 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8514 (2025.01); H01L 25/0753 (2013.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H10H 20/819 (2025.01); H10H 29/142 (2025.01);
Abstract

A micro light-emitting diode display device including a circuit substrate, an epitaxy structure and a conducting layer is provided. The epitaxy structure is electrically connected to the circuit substrate, and includes a connection layer and a plurality of light-emitting mesas. The plurality of light-emitting mesas are disposed on the connection layer, wherein a thickness of the connection layer is less than a thickness of the plurality of light-emitting mesas, and the connection layer has a first surface exposed by the plurality of light-emitting mesas and a second surface opposite to the first surface. The conducting layer is disposed on the second surface of the connection layer and exposes a plurality of sub-areas of the second surface, wherein a vertical projection of the conductive layer onto the connection layer overlaps a vertical projection of the first surface onto the connection layer.


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