The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Aug. 02, 2023
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Daniel Yap, Newbury Park, CA (US);

Florian G. Herrault, Agoura Hills, CA (US);

Christopher S. Roper, Oak Park, CA (US);

Partia Naghibi, Canoga Park, CA (US);

Assignee:

HRL LABORATORIES, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 77/40 (2025.01); G02B 6/42 (2006.01); H10H 20/858 (2025.01);
U.S. Cl.
CPC ...
H10F 77/413 (2025.01); G02B 6/42 (2013.01); H10F 77/407 (2025.01); H10H 20/858 (2025.01);
Abstract

A photonic module and a method of making same, the module having one or more optoelectronic chips, such as a laser diode typically having six sides, with each optoelectronic chip having two opposing sides (a first side and a second side) abutting and electrically connected to metal regions (preferably electro-formed), the two metal regions are physically distinct and electrically separate from each other, the two electro-formed metal regions serving, in use, as heat spreaders for conducting heat away from the optoelectronic chip.


Find Patent Forward Citations

Yap, Daniel. (2026). Photonic integrated module with metal embedded chips (U.S. Patent No. 12598836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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