The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Oct. 20, 2020
Applicant:
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, CN;
Inventor:
Huilong Zhu, Poughkeepsie, NY (US);
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10P 30/20 (2026.01);
U.S. Cl.
CPC ...
H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/112 (2025.01); H10D 62/121 (2025.01); H10D 64/018 (2025.01); H10D 64/258 (2025.01); H10P 30/204 (2026.01); H10P 30/21 (2026.01);
Abstract
The present disclosure provides a semiconductor device, a method for manufacturing the semiconductor device, and electronic equipment including the semiconductor device. According to embodiments, a semiconductor device may include a channel portion, source/drain portions in contact with the channel portion on opposite sides of the channel portion, and a gate stack intersecting the channel portion. The channel portion includes a first part extending in a vertical direction relative to the substrate and a second part extending from the first part in a lateral direction relative to the substrate.