The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
May. 28, 2024
SK Hynix Inc., Icheon-si, KR;
Yoo Hyun Noh, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A method for fabricating a semiconductor device includes forming a source structure over a lower structure with interconnections; forming a first contact plug that penetrates the source structure to be coupled to the interconnections, and a first sacrificial pad that penetrates the source structure and is spaced apart from the first contact plug; forming an upper structure that covers the first sacrificial pad, the first contact plug, and the source structure; forming a second contact plug that penetrates the upper structure and contacts the first contact plug, forming a second sacrificial pad that penetrates the upper structure to contact the first sacrificial pad and is spaced apart from the second contact plug; and replacing the first sacrificial pad and the second sacrificial pad with a dielectric supporter.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile