The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Jul. 05, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dong-Wan Kim, Hwaseong-si, KR;

Keonhee Park, Suwon-si, KR;

Dong-Sik Park, Suwon-si, KR;

Joonsuk Park, Suwon-si, KR;

Jihoon Chang, Yongin-si, KR;

Hyeon-Woo Jang, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/50 (2023.02); H10B 12/09 (2023.02); H10B 12/315 (2023.02); H10B 12/34 (2023.02);
Abstract

A semiconductor device may include a substrate including a cell region, a peripheral region, and a boundary region between the cell region and the peripheral region, bit lines provided on the cell region and extended in a first direction parallel to a top surface of the substrate, bit line capping patterns provided on the bit lines, and a boundary pattern provided on the boundary region. End portions of the bit lines may be in contact with a first interface of the boundary pattern, and the bit line capping patterns may include the same material as the boundary pattern.


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