The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Feb. 14, 2024
Applicant:

Hyundai Mobis Co., Ltd., Seoul, KR;

Inventors:

Chan Yang Choe, Seoul, KR;

Min Ki Kim, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H10W 44/00 (2026.01); H10W 70/05 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 3/0073 (2013.01); H05K 3/06 (2013.01); H10W 44/401 (2026.01); H10W 70/093 (2026.01); H10W 90/701 (2026.01); H05K 2201/10022 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/0323 (2013.01); H05K 2203/1316 (2013.01);
Abstract

An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.


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