The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Oct. 29, 2021
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Shusaku Shibata, Osaka, JP;

Takahiro Ikeda, Osaka, JP;

Teppei Niino, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/44 (2006.01); H05K 1/05 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 3/44 (2013.01); H05K 1/056 (2013.01); H05K 3/108 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09554 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/0979 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.


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