The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Mar. 08, 2023
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Hiroaki Sano, Kagoshima, JP;
Toshifumi Higashi, Kirishima, JP;
Akira Imoto, Kirishima, JP;
Takafumi Yamaguchi, Kirishima, JP;
Sentarou Yamamoto, Kagoshima, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0242 (2013.01); H05K 2201/0263 (2013.01); H05K 2201/0338 (2013.01);
Abstract
The wiring board includes an insulation layer made of ceramic and a conductor layer extending in a planar direction inside the insulation layer. The conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and has a layered structure in which a dense layer, a non-dense layer, and a dense layer are layered in layers in this order in a thickness direction.