The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Jan. 13, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Takayuki Shimamura, Nagaokakyo, JP;

Tomohiro Furumura, Nagaokakyo, JP;

Sunao Fukutake, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 7/02 (2019.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/036 (2013.01); B32B 7/02 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/322 (2013.01); B32B 27/36 (2013.01); H05K 1/0237 (2013.01); H05K 1/0373 (2013.01); B32B 2270/00 (2013.01); B32B 2305/30 (2013.01); B32B 2305/55 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.


Find Patent Forward Citations

Shimamura, Takayuki. (2026). Circuit board and multilayer circuit board (U.S. Patent No. 12598697). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598697

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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