The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Dec. 14, 2022
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Yu-Chi Lu, Taoyuan City, TW;

PO Hsuan Hsiao, Caotun Township, TW;

Ming-Yen Chen, Pingtung City, TW;

Chang Hong Lin, Zhudong Township, TW;

Hsin-Yeh Yang, Taichung City, TW;

Cheng-Hsuan Cheng, Hsinchu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/149 (2017.01); G06T 7/62 (2017.01); G06V 10/44 (2022.01);
U.S. Cl.
CPC ...
G06T 7/149 (2017.01); G06T 7/62 (2017.01); G06V 10/44 (2022.01); G06T 2207/30196 (2013.01);
Abstract

A measuring method and system for body-shaped data are provided. The measuring method comprises: performing a feature extraction on an apparel image to obtain a plurality of apparel feature points by a feature positioning module; performing a contour extraction on the apparel image to obtain an apparel boundary by an image segmentation module; calculating at least one shift value of the apparel feature points relative to the apparel boundary based on the apparel feature points and the apparel boundary by a processing module; correcting at least one of the apparel feature points according to the at least one shift value by the processing module, and projecting the corrected at least one of the apparel feature points to a three-dimensional model and obtaining at least one body-shaped data according to the apparel feature points on the three-dimensional model by the processing module.


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