The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Nov. 09, 2022
Applicant:
Terecircuits Corporation, Mountain View, CA (US);
Inventors:
Jayna Sheats, Palo Alto, CA (US);
Matthew Robinson, Orinda, CA (US);
Assignee:
TERECIRCUITS CORPORATION, Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 1/60 (2012.01); G03F 1/68 (2012.01); G03F 7/00 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2002 (2013.01); G03F 1/60 (2013.01); G03F 1/68 (2013.01); G03F 7/0002 (2013.01); G03F 7/091 (2013.01); G03F 7/092 (2013.01); H01L 2221/68368 (2013.01);
Abstract
A process for transferring a component from a release layer by exposing the release layer to light and heat from different sources is described. The process includes providing an assembly comprising a substrate, a release layer and a component, heating the release layer and exposing the release layer to an actinic wavelength of light, wherein the heating source and the actinic irradiation source are different sources.