The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Aug. 28, 2020
Sany Automobile Manufacturing Co., Ltd., Changsha, CN;
SANY AUTOMOBILE MANUFACTURING CO., LTD., Changsha, CN;
Abstract
The present disclosure provides a boom comprising a frame structure, wherein the boom comprises: a top plate; a bottom plate, wherein the bottom plate and the top plate are oppositely disposed at an interval; a first side plate; and a second side plate, wherein the second side plate and the first side plate are oppositely disposed at an interval, wherein a first side of the top plate is provided with a first bending portion, and at least a portion of the first bending portion and a first end of the first side plate are attached and spliced to each other, a second side of the top plate opposite to the first bending portion is provided with a second bending portion, at least a portion of the second bending portion and a first end of the second side plate are attached and spliced to each other, and a first side of the bottom plate is provided with a third bending portion, at least a portion of the third bending portion and a second end of the first side plate are attached and spliced to each other, a second side of the bottom plate opposite to the third bending portion is provided with a fourth bending portion, at least a portion of the fourth bending portion and a second end of the second side plate are attached and spliced to each other, and define the frame structure. The present disclosure makes the boom more suitable for mass production by splicing out the boom, and the change cost is low compared to the integrally formed mold.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile