Method for area-selective growth of noble metal thin films using atomic layer deposition

Abstract

The method for area-selective growth of a noble metal thin film using atomic layer deposition comprises: a first step of preparing a substrate having a growth area and non-growth area showing a difference in nucleation delay, where the non-growth area generates a noble metal nucleus relatively late compared to the growth area during cycles of repeated atomic layer deposition; a second step of supplying a noble metal precursor and adsorbing the noble metal precursor to the growth area and the non-growth area of the substrate; a third step of converting the noble metal precursor into a noble metal atomic layer by supplying an oxidizing agent; and a step of growing a noble metal thin film in the growth area by repeating a combination of the second and third steps.