The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Jan. 30, 2024
Applicant:

Agc Inc., Tokyo, JP;

Inventors:

Izuru Kashima, Tokyo, JP;

Yusuke Fujiwara, Tokyo, JP;

Assignee:

AGC Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 27/06 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 7/08 (2019.01); B32B 17/06 (2006.01); B60K 35/22 (2024.01); B60K 35/50 (2024.01); B60K 35/60 (2024.01); C03B 23/023 (2006.01);
U.S. Cl.
CPC ...
C03C 27/06 (2013.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B32B 7/08 (2013.01); B32B 17/06 (2013.01); B60K 35/22 (2024.01); B60K 35/50 (2024.01); B60K 35/60 (2024.01); C03B 23/023 (2013.01); B32B 2457/20 (2013.01); B32B 2605/00 (2013.01);
Abstract

A glass substrate includes a thin portion having a first surface and a second surface opposed to the first surface, a thick portion having a first surface and a second surface opposed to the first surface and having a sheet thickness tthat is larger than a sheet thickness tof the thin portion, a connection portion having a first connection surface and a second connection surface, the first connection surface connecting the first surface of the thin portion to the first surface of the thick portion, the second connection surface connecting the second surface of the thin portion to the second surface of the thick portion. The first connection surface has a curvature radius of more than or equal to 400 μm.


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