The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Mar. 28, 2022
Schott Ag, Mainz, DE;
Robert Hettler, Kumhausen, DE;
Jens Ulrich Thomas, Mainz, DE;
Antti Määttänen, Tampere, SE;
Jochen Herzberg, Allhaming, AT;
Yutaka Onezawa, Otsu, JP;
Thomas Zetterer, Landshut, DE;
Schott AG, Mainz, DE;
Abstract
A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.