The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2026

Filed:

Mar. 27, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Shinichi Yotsuya, Chino, JP;

Masahiro Fujii, Shiojiri, JP;

Koji Kitahara, Ina, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/162 (2013.01); B41J 2/1433 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/164 (2013.01); B41J 2002/14475 (2013.01);
Abstract

A method of manufacturing a liquid discharging head includes a pressure chamber substrate that includes a pressure chamber and a nozzle substrate that includes a nozzle communicating with the pressure chamber and is formed of a semiconductor substrate, the method including a first step in which, in a state where a metal film is formed on the nozzle substrate in a first portion corresponding to the nozzle of a first surface which is a surface of the nozzle substrate on a pressure chamber substrate side, and the metal film is not formed on the nozzle substrate in a second portion not corresponding to the nozzle of the first surface, the nozzle is formed by carrying out metal assist chemical etching.


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