The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
May. 26, 2023
Applicants:
Tyco Electronics (Suzhou) Ltd., Suzhou City, CN;
Tyco Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Assignees:
Tyco Electronics (Suzhou) Ltd., Suzhou City, CN;
Tyco Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/26 (2006.01); B29C 33/38 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 33/3828 (2013.01); B29C 33/3842 (2013.01); B29C 45/26 (2013.01); B33Y 80/00 (2014.12); B29K 2905/10 (2013.01); B29K 2905/12 (2013.01);
Abstract
An injection mold insert includes a housing of a first material and an inner core of a second material sealed in the housing of the first material. A mechanical strength of the first material is greater than that of the second material. The thermal conductivity of the second material is greater than that of the first material. The inner core is formed by filling a molten liquid of the second material into an inner cavity of the housing.