The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Sep. 30, 2022
Applicant:

Lx Semicon Co., Ltd., Daejeon, KR;

Inventors:

Dam Ha, Daejeon, KR;

Kyung Hyun Kim, Daejeon, KR;

Assignee:

LX SEMICON CO., LTD., Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 24/16 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A chip on film package according to one embodiment of the present disclosure includes: a base film; a wiring unit located on the base film; a semiconductor chip mounted on the wiring unit; a first heat dissipation unit configured to come into contact with the semiconductor chip; a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprise a metal; and an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween.


Find Patent Forward Citations

Quick Actions:

Ha, Dam. (2026). Chip on film package and display device including the same (U.S. Patent No. 12593696). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12593696

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