The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Jun. 18, 2025
Applicant:

Auradine, Inc., Santa Clara, CA (US);

Inventors:

Anuya Reddy, Pleasanton, CA (US);

Lyle Looney, Livermore, CA (US);

Darshan Shah, Milpitas, CA (US);

Pranav Kalyanraman, Santa Clara, CA (US);

Larry Yu, Santa Clara, CA (US);

Assignee:

Auradine, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/10 (2013.01); H01L 23/42 (2013.01); H01L 24/32 (2013.01); H01L 2224/32245 (2013.01);
Abstract

Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.


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