The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
May. 20, 2022
Applicant:
Amogreentech Co., Ltd., Gimpo-si, KR;
Inventor:
Jihyung Lee, Cheonan-si, KR;
Assignee:
AMOGREENTECH CO., LTD., Gimpo-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/858 (2025.01); H01L 23/00 (2006.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8586 (2025.01); H01S 5/0206 (2013.01); H01S 5/02469 (2013.01); H10H 20/8583 (2025.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H10H 20/0365 (2025.01);
Abstract
The present invention relates to a ceramic substrate with a heat sink and a manufacturing method thereof. The ceramic substrate comprises: a ceramic substrate including a metal layer on at least one surface of a ceramic base; and a heat sink that is bonded to one surface of the ceramic substrate and has a multi-layer structure that refrigerant enters and exits. The present invention has an integrated structure in which the heat sink having a multi-layer structure that refrigerant enters and exits is bonded to the ceramic substrate, and thus is capable of effectively dissipating heat generated from a semiconductor chip.