The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

May. 15, 2023
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Ambarish Roy, Arlington, MA (US);

Richard Peter Gulezian, II, Atkinson, NH (US);

Lakshminarayanan Alampoondi Venkatesan, Woburn, MA (US);

Nuttapong Srirattana, Lexington, MA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 87/00 (2025.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H10D 86/00 (2025.01); H10D 86/80 (2025.01);
U.S. Cl.
CPC ...
H10D 87/00 (2025.01); H01L 23/481 (2013.01); H01L 23/5286 (2013.01); H01L 23/66 (2013.01); H10D 86/201 (2025.01); H01L 2223/6677 (2013.01);
Abstract

Disclosed is a silicon on insulator (SOI) radio frequency (RF) module with noise reduction shielding to mitigate radio frequency interference (RFI) between active circuit devices within the module. The RF module includes various semiconductor active devices disposed upon an insulating substrate. The RF module can be a front-end module (FEM) with one or more charge pumps as active devices. A polysilicon web extends between and underneath the devices to create a network of ground paths across a surface of the insulating substrate. The ground paths effectively conduct RF noise to a circuit ground, causing the polysilicon ground web to eliminate or substantially attenuate RFI produced by the active devices without altering signal characteristics of the RF module. The disclosed solution also reduces RF noise leakage into the substrate, and can reduce RFI between neighboring RF modules.


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