The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Dec. 20, 2023
Applicant:

National Tsing Hua University, Hsinchu City, TW;

Inventor:

Shwin-Chung Wong, Hsinchu City, TW;

Assignee:

National TsingHua University, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0275 (2013.01); H01L 23/427 (2013.01); H05K 7/2039 (2013.01);
Abstract

A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.


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