The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Jan. 20, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jin UK Lee, Suwon-si, KR;

Youn Gyu Han, Suwon-si, KR;

Jin Won Lee, Suwon-si, KR;

Da Yeon Lee, Suwon-si, KR;

Yong Duk Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 2201/10325 (2013.01);
Abstract

A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.


Find Patent Forward Citations

Lee, Jin. (2026). Printed circuit board (U.S. Patent No. 12593403). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12593403

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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