The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Apr. 21, 2020
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H01Q 1/38 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 1/0274 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A wiring board () includes a substrate () that is transparent, a wiring pattern region () disposed on the substrate () and having first-direction wiring lines (), and a feeding unit () electrically connected to the first-direction wiring lines () of the wiring pattern region (). Each first-direction wiring line () has a first region () positioned near the feeding unit () and a second region () that is a region other than the first region (). A line width (W) of the first-direction wiring line () in the first region () is larger than a line width (W) of the first-direction wiring line () in the second region ().