The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Sep. 19, 2022
Applicant:
Fortemedia, Inc., Santa Clara, CA (US);
Inventors:
Yen-Son Paul Huang, Santa Clara, CA (US);
Iou-Din Jean Chen, Fremont, CA (US);
Shih-Chung Wang, Hsinchu City, TW;
Yung-Wei Chen, Zhubei City, TW;
Assignee:
FORTEMEDIA, INC., Alviso, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0074 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/096 (2013.01); H04R 2201/003 (2013.01);
Abstract
A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface and a second surface opposite to the first surface. The IC die is stacked on the first surface of the first MEMS sensor die. The first conductive lid is disposed on the second surface of the first MEMS sensor die.