The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Dec. 16, 2022
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

Nguyen Nguyen, Lowell, MA (US);

Trong Phan, Lowell, MA (US);

Duy Nguyen, Lowell, CA (US);

Thanh Pham, Lowell, CA (US);

Stefano D'agostino, Lowell, CA (US);

Wayne Kennan, Lowell, CA (US);

William Allen, Lowell, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 5/08 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/082 (2013.01); H01P 3/081 (2013.01); H01P 5/08 (2013.01); H01P 11/003 (2013.01);
Abstract

An enhanced electrical circuit can employ conductive fill components that can facilitate providing desirable resistive stabilization of the electrical circuit and other desirable circuit qualities without having to use a physical resistor. The electrical circuit can comprise a transmission line, which can be a microstrip line, that can have defined dimensions. The electrical circuit can comprise respective conductive fill components that can be in proximity to desired sides of the transmission line, wherein the respective conductive fill components can provide the desired resistive stabilization for the electrical circuit. The respective conductive fill components can be separated from, and not in contact with, each other based on respective gaps of a defined size(s) between respective adjacent conductive fill components. The respective conductive fill components can be across a single layer or multiple layers of conductive fill components.


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