The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jan. 31, 2024
Coretronic Corporation, Hsin-Chu, TW;
Shao-Peng Su, Hsin-Chu, TW;
Te-Ying Tsai, Hsin-Chu, TW;
Coretronic Corporation, Hsin-Chu, TW;
Abstract
A cooling system includes a flow channel structure including flow channel substrates, a first outer substrate, a first inner adsorption layer, a first outer adsorption layer, and a first heat insulating layer and a first cooling chip having a cold side and a hot side opposite to each other. The flow channel substrates surround to form an air flow channel and include a first inner substrate with a second surface facing the air flow channel and a first surface disposed on the cold side. A first surface of the first outer substrate is disposed on the hot side. The first inner adsorption layer is disposed on the second surface of the first inner substrate. The first outer adsorption layer is disposed on a second surface of the first outer substrate. The first heat insulating layer is disposed between the first inner substrate and the first outer substrate.