The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jun. 02, 2022
Applicant:
Hitachi High-tech Corporation, Tokyo, JP;
Inventors:
Assignee:
HITACHI HIGH-TECH CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/38 (2006.01); G02B 5/18 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
G02B 5/1852 (2013.01); B29D 11/00769 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 17/061 (2013.01); B32B 17/10 (2013.01); B32B 27/38 (2013.01); B29K 2063/00 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2307/416 (2013.01); B32B 2307/418 (2013.01); B32B 2551/00 (2013.01);
Abstract
This invention relates to a method of manufacturing a diffraction grating. First, a waferhaving, on a front surface FSthereof, a patternhaving a shape in which concave portions and convex portions are alternately arranged is prepared. Next, a metal filmis formed on the front surface FSof the wafer, and a transfer areato which the shape of the patternis transferred is formed on a part of a front surface FSof the metal film. Next, the metal filmis removed from the wafer. Next, a back surface BSof the metal filmis bonded to a glass substratevia a bonding agent