The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Apr. 21, 2022
Applicant:

Hesai Technology Co., Ltd., Shanghai, CN;

Inventors:

Chao Zhang, Shanghai, CN;

Shaoqing Xiang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/481 (2006.01); H01S 5/024 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G01S 7/4813 (2013.01); G01S 7/4814 (2013.01); H01S 5/02469 (2013.01); H05K 1/0203 (2013.01); H05K 7/20509 (2013.01);
Abstract

A lidar is provided. The lidar comprises an emitting chamber, where at least one first printed circuit board and a film-shaped first heat dissipation component corresponding to the first printed circuit board is disposed therein. A laser emitter is disposed on the first printed circuit board which is configured to drive the laser emitter to emit a laser pulse. The first heat dissipation component includes a thermally conductive assembly portion and a heat dissipation assembly portion that are not coplanar. The thermally conductive assembly portion is attached on a back face of the first printed circuit board corresponding to the thermally conductive assembly portion. A portion of the heat dissipation assembly portion is connected to a chamber wall forming the emitting chamber. Temperature of the first printed circuit board is controlled to solve lidar reliability problem caused by overheating of the first printed circuit board.


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