The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Sep. 27, 2023
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/20 (2006.01); H01C 1/08 (2006.01); H01C 1/14 (2006.01); H01L 23/495 (2006.01); H01L 25/18 (2023.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/203 (2013.01); H01C 1/08 (2013.01); H01C 1/14 (2013.01); H01L 23/49575 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01);
Abstract
A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.