The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Aug. 11, 2021
Applicant:

Johnson Controls Tyco Ip Holdings Llp, Milwaukee, WI (US);

Inventors:

Cameron Stuart Nelson, New Freedom, PA (US);

William Leslie Kopko, Jacobus, PA (US);

Assignee:

Tyco Fire & Security GmbH, Neuhausen am Rheinfall, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F24F 1/24 (2011.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F24F 1/24 (2013.01); F28D 15/0266 (2013.01); H05K 7/20263 (2013.01); H05K 7/20309 (2013.01);
Abstract

The present disclosure relates to a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes an enclosure defining a fluid chamber, and the enclosure includes an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component coupled to the enclosure, where the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and includes a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface.


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