The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Apr. 20, 2022
National Technical University of Athens, Athina, GR;
Ioanna Zergioti, Athens, GR;
Bar-ilan University, Ramat-Gan, IL;
Graphenea Semiconductor S.l.u., Donostia, ES;
Ioanna Zergioti, Athens, GR;
Symeon Papazoglou, Athens, GR;
Filimon Zacharatos, Athens, GR;
Adamantia Logotheti, Athens, GR;
Amaia Pesquera, Donostia-San Sebastian, ES;
Amaia Zurutuza, Donostia-San Sebastian, ES;
Doron Naveh, Petach Tikva, IL;
[object Object];
National Technical University of Athens, Athina, GR;
Bar-Ilan University, Ramat-gan, IL;
Graphenea Semiconductor S.L.U., Donostia, ES;
Abstract
A system and method for performing is laser induced forward transfer (LIFT) of 2D materials is disclosed. The method includes generating a receiver substrate, generating a donor substrate, wherein the donor substrate comprises a back surface and a front surface, applying a coating to the front surface, wherein the coating includes donor material, aligning the front surface of the donor substrate to be parallel to and facing the receiver substrate, wherein the donor material is disposed adjacent to the target layer, and irradiating the coating through the back surface of the donor substrate with one or more laser pulses produced by a laser to transfer a portion of the donor material to the target layer. The donor material may include BiSeS, MOS, hexagonal boron nitride (h-BN) or graphene. The method may be used to create touch sensors and other electronic components.