The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jul. 15, 2021
Fuji Polymer Industries Co., Ltd., Nagoya, JP;
Shingo Kobayashi, Aichi, JP;
Yuko Kimura, Aichi, JP;
Fuji Polymer Industries Co., Ltd., Aichi, JP;
Abstract
A thermally conductive silicone heat dissipating material contains a silicone polymer, a thermally conductive inorganic filler, and a heat resistance improver. The thermally conductive inorganic filler has a BET specific surface area (A) of 0.3 m/g or more and is surface treated with a surface treatment agent expressed by Si(OR')or RSi(OR′)(where R represents a hydrocarbon group having 1 to 4 carbon atoms or an aromatic hydrocarbon group having 6 to 12 carbon atoms, R′ represents a hydrocarbon group having 1 to 4 carbon atoms, and x represents an integer of 1 to 2). The content of the thermally conductive inorganic filler is 100 to 10000 parts by mass with respect to 100 parts by mass of the silicone polymer. The thermally conductive inorganic filler having a large specific surface area and a small average particle size is surface treated with a silane coupling agent with a low molecular weight, so that the heat resistance of the thermally conductive silicone heat dissipating material is improved.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile