The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Mar. 23, 2021
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Kiyoul Yoon, Daejeon, KR;

Seongkyun Kang, Daejeon, KR;

Yu Jin Kim, Daejeon, KR;

Gicheul Kim, Daejeon, KR;

Hyosook Joo, Daejeon, KR;

Hyeon Choi, Daejeon, KR;

Se Yeol Park, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B01J 20/26 (2006.01); B01J 20/28 (2006.01); B01J 20/30 (2006.01); B01J 20/32 (2006.01); C08F 2/44 (2006.01); C08F 2/50 (2006.01); C08F 20/06 (2006.01); C08J 3/075 (2006.01); C08J 3/24 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B01J 20/267 (2013.01); B01J 20/28033 (2013.01); B01J 20/28085 (2013.01); B01J 20/3064 (2013.01); B01J 20/3078 (2013.01); B01J 20/3282 (2013.01); C08F 2/44 (2013.01); C08F 2/50 (2013.01); C08F 20/06 (2013.01); C08J 3/075 (2013.01); C08J 3/242 (2013.01); B01J 2220/68 (2013.01); C08J 2333/02 (2013.01);
Abstract

The present disclosure relates to a preparation method for a super absorbent polymer film. Specifically, it relates to a preparation method for a new type of super absorbent polymer film, which is thin and exhibits excellent absorption performance. In addition, the super absorbent polymer film of the present disclosure has excellent flexibility and excellent mechanical properties, is free from scattering or leaking, and does not require an auxiliary substance such as pulp, so that products can be made thinner and the manufacturing process and costs may be reduced.


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