The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Mar. 16, 2021
Applicant:
Adeka Corporation, Tokyo, JP;
Inventors:
Assignee:
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/40 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/245 (2013.01); C08G 59/5033 (2013.01); C08G 59/686 (2013.01); C08G 59/687 (2013.01); C08L 63/00 (2013.01);
Abstract
Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1): wherein X is an oxygen atom or a sulfur atom; Rand Reach independently represent a hydrogen atom, an alkyl group, or an aryl group; and Rand Reach independently represent a hydrogen atom, an alkyl group, or an aryl group, or Rand Rare connected to each other to represent a divalent group to form a ring.
Endo, Takeshi. (2026). Curable resin composition and method for suppressing curing shrinkage of curable resin composition (U.S. Patent No. 12590178). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12590178
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile